otprint full size board with metalized back and with small clip heatsink (still air) www.irf.com 3 Free Datasheet http://www.Datasheet4U.com IRF6691PbF 1000 TOP VGS 10.

PCB assembly equipment and vapor phase, infra-red or convection soldering techniques. Application note AN-1035 is follo.

The IRF6691PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package .

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